Bostik Relaunches Bio-based Thermelt® Hot Melt Adhesives
Bostik reports that their Thermelt® hot melt polyamide range is continuously improved to be relevant for customers as they face sustainability challenges posed by modern manufacturing processes. Made predominantly from renewable raw materials, including rapeseed and castor bean derivatives, the company reports that Thermelt offers easy processing at low pressure and low temperatures, and facilitates disassembly at the end of a product’s lifecycle. This results in less waste and increased opportunities for component recycling.
Thermelt is a non-reactive, solvent-free and bio-based adhesive designed for applications from assembly processes in the shoe industry to Low Pressure Molding (LPM) applications used in the electronic and automotive component manufacturing sectors. Bostik reports that the product is increasingly being used in new and emerging technologies in agriculture, electric vehicles, and batteries.
The hot melt is made from up to 90% bio-based raw materials and enables products to be easily disassembled. This supports manufacturers’ goals to achieve circularity and lessen the environmental impact of products while maintaining their performance, according to the company.
“For 40 years, Bostik has been investing heavily in developing this product to meet the changing needs of both assembly and LPM manufacturing,” said Polivio Goncalves, head of engineering, Adhesives at Bostik. “Since the 1980s for instance, the continuing miniaturization and sophistication of electronics has led to sensors which are a pervasive part of life today, from electric vehicles to solar panels, to smart devices. Bostik has continuously reformulated Thermelt to provide the additional strength and protection these increasingly sensitive components need.”
Source: Bostik